Type: M.2 2280
Dimensions: 80 mm x 22 mm x 3.77 mm (3.15" x 0.87" x 0.15")
Weight: 10 g (0.35 oz)
Heatsink Type: Graphene Heatsink
Connection Interface Connection Interface Bus: NVMe PCIe Gen5 x4
Memory Flash Type: 3D NAND Flash
Capacity: 2 TB
Operating Environment Operating Temperature: 0°C (32°F) to 70°C (158°F)
Operating Voltage: 3.3V ± 5%
Performance
Max. Sequential Read/Write Speed (CrystalDiskMark): 2 TBUp to 14,000/11,000 MB/s
Random 4K Read/Write Speed (IOmeter): 2 TBUp to 1,400,000/1,100,000 IOPS
TeraBytes Written (TBW): 2 TB1,500 TBW
Mean Time Between Failures (MTBF): 2,000,000 hour(s)
Write Cycles per Day (DWPD): 0.411 (5 years)
Certificates: CE/UKCA/FCC/BSMI/KC/RCM
System Requirement
Operating System: Microsoft Windows 7 or later, Linux Kernel 2.6.31 or newer
S.M.A.R.T. Technology
Advanced Garbage Collection RAID Engine LDPC Coding DRAM Cache